A RESEARCH ON CHI-1 UF RESIN WITH LOWER FREE FORMALDEHYDE FOR PARTICLE BOARD

The UF resin is a principal adhesive for particle board,in order to decrease the free formaldehyde in urea-formaldehyde resin adhesive,the peopel often decrease expense of formaldehyde during the synthesis.In this way,the strength of particle board and its waterproof are lowered,and the curing time of resin is prolonged.That is why the auther began to research CHI-1.The synthetic technology is used by means of changing the craft of synthesis,CHI-1 UF resin differs from other UF resins as follows:1.with a craft of mild tom-prature;2.with wider adaptability to change pH and temperature;3.with a proportion(about 1:1.4) of gramme-molecule and its free formaldehyde under 0.5%.