RESEARCH ON MAIN PROCESSING PARAMETERS OF BAMBOO-BASED WAFERBOARD

Based on the outcomes from the pre-experiments,the glued structure of randomlymatted wafers and the general procedures with a series of related parameters,such keyprocessing parameters as the thickness of the wafer,glue content and temperature duringhot-pressing are optimized in this study to support the reliable basic technology theory forindustrial production of bamboo-based waferboard.Results from the comprehensiveorthogonal experiment show that bamboo-based waferboard with equal quality to woodyones can be made under proper technological conditions.