Abstract: The curing time and adaptability phase of the urea formaldehyde (UF) resin adhesive at low mole of UF were studied under different curing systems, and the influence of UF upon the bonding strength and quantity of formaldehyde emission level were analyzed. The study results showed that although the different curing system resulted in different physical mechanic performance, the bonding properties of the adhesives all reached the standard of GB/T 9846.3—2004 Grade II, and the formaldehyde emission level all accorded with the standard of GB/T 9846.3—2004 E0 Grade. The best mechanical properties could be obtained by using the NO-J0-1, when the n(F)∶n(U) ratio was 1∶1 and the V(a curing system)∶m(glue) ratio was 5 mL ∶100 g.